DDR3L- Commercial-Grade
Key Features: Downward compatible with DDR3, supports 1.35V and 1.5V; DDR3L memory consumes 15% less power than standard DDR3.
| Part Number (PN) | Capacity |
|---|---|
| YX3H1816AB-M9LC | 1GB |
| YX3H1816AB-MALC | 1GB |
| YX3H2816AB-M9LC | 2GB |
| YX3H2816AB-MALC | 2GB |
| YX3H4816AB-M9LC | 4GB |
| YX3H4816AB-MALC | 4GB |
Bit Widthx8/x16
Package Size
1Gb: BGA78 (7.5mm × 10.6mm × 1.2mm)
BGA96 (7.5mm × 13.5mm × 1.2mm)
2Gb: BGA78 (7.5mm × 10.6mm × 1.2mm)
BGA96 (7.5mm × 13.5mm × 1.2mm)
4Gb: BGA78 (9.0mm × 10.6mm × 1.2mm)
BGA96 (9.0mm × 13mm × 1.2mm)
Operating Temperature 0℃~95℃
Voltage1.35V/1.5V
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YuXin DDR3L (1Gb/2Gb/4Gb) is a low-voltage, high-performance embedded DRAM compliant with JEDEC standards, designed for industrial control, IoT, automotive terminals, and embedded motherboards.
JEDEC-compliant low-voltage embedded DRAM with 1Gb~4Gb capacity and ×8/×16 bit width. DDR3L-*M9LC: 1866Mbps; DDR3L-*MALC: 2133Mbps. Drop-in replacement for mainstream platforms—no board redesign required. Operating at 1.35V, this device reduces power consumption by 15% compared to DDR3, with self-refresh current as low as 10mA. ODT signal calibration and Write Leveling multi-chip parallel technology ensure high-speed stability, making it ideal for industrial control, automotive, and IoT applications.
