Raw NAND

Raw NAND

Key Features: Built on mature 3D TLC flash technology for high reliability and performance.
Part Number (PN)CapacitySpeed
YXN0ATF1B1HPAD512GB2400 MT/s, 3600 MT/s
1024GB2400 MT/s, 3600 MT/s
2048GB2400 MT/s, 3600 MT/s
512GB2400 MT/s, 3600 MT/s
1024GB2400 MT/s, 3600 MT/s
Package Size
BGA132 (12mm × 18mm × 1.0mm)
BGA154 (11.5mm × 13.5 × 1.0mm)
BGA272 (14mm × 18mm × 1.0mm)
Operating Temperature0℃--70℃
Interface TypeSupports ONFI 4.1/5.0/5.1
On Sale
PC App
LaptopMini PCDesktopAll-in-One
Data Center
ServerCloud ComputingStorage Array

Yuxin Raw NAND is built on high-quality domestic 3D NAND wafers and supports ONFI/Toggle standards, designed for embedded systems, industrial control, IoT, and similar applications.

Standard NAND packaging supporting ONFI/Toggle protocols, covering capacities from firmware storage to system images. 3D stacking delivers high density and cost efficiency. With significantly improved P/E endurance compared to planar NAND, hardware-level ECC error correction, and shock resistance for mechanical reliability, it is ideal for automotive and industrial applications. Low-power design ensures compatibility with battery-powered devices, maintaining performance under sustained high loads. A cost-effective storage solution for large-capacity embedded scenarios.

Hubei ICP Prepared 2025159093 No. -1|Hubei ICP Prepared 2025159093 No. -1